Apple:
Apple today announced a new multiyear commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies for a wide range of Apple products. The new agreement, expected to exceed $30 billion, will lead to the production of more than 15 billion U.S.-made chips and support hundreds of American jobs.
Apple has been working with the administration and businesses across the U.S. to help create an end-to-end silicon supply chain in America, and today’s announcement advances those efforts.
Broadcom will produce advanced radio frequency components — including FBAR filters — and advanced wireless connectivity technologies at the Fort Collins facility.
From Thin-film bulk acoustic resonator on Grokipedia:
Thin-film bulk acoustic resonators (FBARs) are widely employed in radio frequency filters and duplexers due to their ability to provide high-quality factor operation, low insertion loss, and compact size, making them essential components in wireless communication front-ends.
Duplexers, which simultaneously support transmit and receive paths while isolating them, represent a primary application of FBAR technology, particularly in handset antennas operating at frequencies from 900 MHz to over 5 GHz.
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